Invention Grant
- Patent Title: Film thickness measuring apparatus and film thickness measuring method
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Application No.: US17035519Application Date: 2020-09-28
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Publication No.: US11293750B2Publication Date: 2022-04-05
- Inventor: Shiro Kawaguchi , Kazuya Nakajima
- Applicant: Otsuka Electronics Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Otsuka Electronics Co., Ltd.
- Current Assignee: Otsuka Electronics Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-203869 20191111
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01N21/25

Abstract:
A film thickness measuring apparatus including: a measurement light path for irradiating a measurement target object with light from a light source; a correction light path for irradiating a reference member with light from the light source; and a light switching unit that selectively guides reflected light from the measurement target object or reflected light from the reference member, to a spectroscope.
Public/Granted literature
- US20210140758A1 FILM THICKNESS MEASURING APPARATUS AND FILM THICKNESS MEASURING METHOD Public/Granted day:2021-05-13
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