Invention Grant
- Patent Title: Integrated circuit and method for capturing baseline die temperature data
-
Application No.: US17363739Application Date: 2021-06-30
-
Publication No.: US11293808B1Publication Date: 2022-04-05
- Inventor: Soumyajit Routh , Kevin M. Gertiser , Jack L. Glenn , John Mark Dikeman , Daniel C. Penrod
- Applicant: DELPHI TECHNOLOGIES IP LIMITED
- Applicant Address: BB St. Michael
- Assignee: DELPHI TECHNOLOGIES IP LIMITED
- Current Assignee: DELPHI TECHNOLOGIES IP LIMITED
- Current Assignee Address: BB St. Michael
- Agency: Bookoff McAndrews, PLLC
- Agent Joshua M. Haines
- Main IPC: G01K3/00
- IPC: G01K3/00 ; G01R31/3177 ; G01R31/317 ; G01K7/00

Abstract:
A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.
Information query