An apparatus for analysis of metals is provided. The apparatus includes a molding cavity for receiving a sample of a molten metal, a gating system for allowing the molten metal to be poured, and a vent for allowing gases to escape from the apparatus when the molten metal is poured. The apparatus further includes at least one chill plate, adjacent to the molding cavity, for enabling faster cooling and solidification of the sample of the molten metal. The apparatus also includes a longitudinal slot, extending from the molding cavity, for allowing a sensor element to be introduced into the sample of the molten metal, the sensor element is a thermocouple wire that is used to monitor a cooling curve of the molten metal, while the molten metal solidifies.