Invention Grant
- Patent Title: High sensitivity ISFET sensor
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Application No.: US16413865Application Date: 2019-05-16
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Publication No.: US11293897B2Publication Date: 2022-04-05
- Inventor: Katherine H. Chiang , Jui-Cheng Huang , Ke-Wei Su , Tung-Tsun Chen , Wei Lee , Pei-Wen Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: G01N27/414
- IPC: G01N27/414 ; G01N33/543 ; G01N27/02

Abstract:
Various embodiments of the present application are directed towards an ion-sensitive field-effect transistor for enhanced sensitivity. In some embodiments, a substrate comprises a pair of first source/drain regions and a pair of second source/drain regions. Further, a first gate electrode and a second gate electrode underlie the substrate. The first gate electrode is laterally between the first source/drain regions, and the second gate electrode is laterally between the second source/drain regions. An interconnect structure underlies the substrate and defines conductive paths electrically shorting the second source/drain regions and the second gate electrode together. A passivation layer is over the substrate and defines a first well and a second well. The first and second wells respectively overlie the first and second gate electrodes, and a sensing layer lines the substrate in the first and second wells. In some embodiments, sensing probes are in the first well, but not the second well.
Public/Granted literature
- US20200173958A1 HIGH SENSITIVITY ISFET SENSOR Public/Granted day:2020-06-04
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