Invention Grant
- Patent Title: Interface element for a testing apparatus of electronic devices and corresponding manufacturing method
-
Application No.: US16808305Application Date: 2020-03-03
-
Publication No.: US11293941B2Publication Date: 2022-04-05
- Inventor: Roberto Crippa , Riccardo Vettori
- Applicant: Technoprobe S.p.A.
- Applicant Address: IT Cernusco Lombardone
- Assignee: Technoprobe S.p.A.
- Current Assignee: Technoprobe S.p.A.
- Current Assignee Address: IT Cernusco Lombardone
- Agency: Seed Intellectual Property Law Group LLP
- Priority: IT102017000100522 20170907
- Main IPC: G01R1/02
- IPC: G01R1/02 ; G01R1/04 ; G01R1/067

Abstract:
An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).
Information query