Invention Grant
- Patent Title: Probing device
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Application No.: US16745888Application Date: 2020-01-17
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Publication No.: US11293975B2Publication Date: 2022-04-05
- Inventor: Choon Leong Lou
- Applicant: TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Applicant Address: CN Suzhou Industrial Park Suzhou
- Assignee: TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Current Assignee: TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Current Assignee Address: CN Suzhou Industrial Park Suzhou
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201911372048.4 20191227
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
A probing device includes a chuck configured to support a device under test (DUT); and a manipulator or probe card disposed above the chuck and including a plurality of probes protruding from the manipulator towards the chuck, wherein the chuck includes a roughened surface and vacuum suction holes for placement of wafer.
Public/Granted literature
- US20210199711A1 PROBING DEVICE Public/Granted day:2021-07-01
Information query
