Invention Grant
- Patent Title: Die-to-die connectivity monitoring
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Application No.: US17205780Application Date: 2021-03-18
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Publication No.: US11293977B2Publication Date: 2022-04-05
- Inventor: Eyal Fayneh , Guy Redler , Evelyn Landman , Ishai Zeev Cohen , Shaked Rahamim , Alex Khazin
- Applicant: proteanTecs Ltd.
- Applicant Address: IL Haifa
- Assignee: proteanTecs Ltd.
- Current Assignee: proteanTecs Ltd.
- Current Assignee Address: IL Haifa
- Agency: The Roy Gross Law Firm, LLC
- Agent Roy Gross
- Main IPC: G01R31/10
- IPC: G01R31/10 ; H01L23/538 ; H03K19/003 ; G01R31/3173 ; G01R31/30

Abstract:
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
Public/Granted literature
- US20210325455A1 DIE-TO-DIE CONNECTIVITY MONITORING Public/Granted day:2021-10-21
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