Provided is a sensor module that includes: a casing; a contacted part that is disposed so that at least a part thereof is exposed to the outside of the casing and that has conductivity; and a detection part that has an electrostatic capacitance type detection pad and that is disposed inside the casing. The detection part further includes a conductive plate provided so as to correspond to the detection region of the detection pad, the contacted part being electrically connected to the conductive plate. This configuration makes it possible to provide a sensor module that is highly sensitive to contact with an object, and that prevents damage to the detection pad caused by contact with the object.