Invention Grant
- Patent Title: Member for semiconductor manufacturing device
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Application No.: US16127923Application Date: 2018-09-11
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Publication No.: US11295934B2Publication Date: 2022-04-05
- Inventor: Yasutaka Nitta
- Applicant: TOTO LTD.
- Applicant Address: JP Kitakyushu
- Assignee: TOTO LTD.
- Current Assignee: TOTO LTD.
- Current Assignee Address: JP Kitakyushu
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: JPJP2016-178671 20160913,JPJP2017-173746 20170911
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C24/04

Abstract:
According to one embodiment, a member for a semiconductor manufacturing device includes an alumite base material including a concavity, and a first layer formed on the alumite base material and including an yttrium compound. The first layer includes a first region, and a second region provided in the concavity and located between the first region and the alumite base material. An average particle diameter in the first region is shorter than an average particle diameter in the second region.
Public/Granted literature
- US20190027343A1 MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE Public/Granted day:2019-01-24
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