Invention Grant
- Patent Title: Broadband plasma processing systems and methods
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Application No.: US16717024Application Date: 2019-12-17
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Publication No.: US11295937B2Publication Date: 2022-04-05
- Inventor: Jianping Zhao , Peter Ventzek
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01J37/32 ; H01L21/311
Abstract:
A method of operating a plasma processing system includes determining a first frequency to power a first plasma within a plasma processing chamber. The method includes generating a first amplified RF signal having the first frequency at a broadband power amplifier. The method includes supplying the first amplified RF signal to process a substrate disposed in the plasma processing chamber using a first plasma process including the first plasma. The method includes determining a second frequency to power a second plasma within the plasma processing chamber. The method includes generating a second amplified RF signal having the second frequency at the broadband power amplifier. The method includes supplying the second amplified RF signal to process the substrate disposed in the plasma processing chamber using a second plasma process including the second plasma.
Public/Granted literature
- US20210082667A1 Broadband Plasma Processing Systems and Methods Public/Granted day:2021-03-18
Information query
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