Invention Grant
- Patent Title: Transistor
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Application No.: US16422803Application Date: 2019-05-24
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Publication No.: US11295955B2Publication Date: 2022-04-05
- Inventor: Yong Li
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201610231449.8 20160414
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/8238 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L27/092 ; H01L21/02 ; H01L21/768 ; H01L29/49

Abstract:
A transistor is provided and includes a substrate; a first interlayer dielectric layer disposed on the substrate, the first interlayer dielectric layer including an opening there-through; a work function layer at least disposed over a bottom of the opening; a gate electrode layer disposed in the opening and over the work function layer; and a protection layer disposed on the work function layer and between the gate electrode layer and the first interlayer dielectric layer.
Public/Granted literature
- US20190295847A1 TRANSISTOR Public/Granted day:2019-09-26
Information query
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