Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US16704077Application Date: 2019-12-05
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Publication No.: US11295966B2Publication Date: 2022-04-05
- Inventor: Hiroshi Yoshida , Takahiro Kawazu
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2018-233583 20181213
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306 ; H01L21/66

Abstract:
A substrate processing method includes generating a plurality of records each including a piece of recipe information in a substrate processing in association with control value information of a control target in the substrate processing, storing the plurality of records generated in the generating, acquiring recipe information input by an operator when performing the substrate processing, reading a record including recipe information identical to the recipe information acquired in the acquiring, and controlling the control target based on the control value information in the recipe information of the record read in the reading.
Information query
IPC分类: