Invention Grant
- Patent Title: Substrate support device, substrate conveyance robot, and aligner device
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Application No.: US16689089Application Date: 2019-11-20
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Publication No.: US11295976B2Publication Date: 2022-04-05
- Inventor: Joseph Chang , Katsuhiko Shimada , Nobuyuki Furukawa , Yong-Gu Kang
- Applicant: KABUSHIKI KAISHA YASKAWA DENKI
- Applicant Address: JP Kitakyushu
- Assignee: KABUSHIKI KAISHA YASKAWA DENKI
- Current Assignee: KABUSHIKI KAISHA YASKAWA DENKI
- Current Assignee Address: JP Kitakyushu
- Agency: Mori & Ward, LLP
- Priority: JPJP2018-223225 20181129
- Main IPC: H01L21/687
- IPC: H01L21/687 ; B65G47/90

Abstract:
A substrate support device includes a blade and at least one pad provided on the blade to support a substrate. The pad includes a first fixed member, a second fixed member, and a bridge. The first fixed member is provided at an outer portion of the blade. The outer portion is located outside an outer circumference portion of the substrate when the substrate is supported on the pad. The second fixed member is provided at an inner portion of the blade. The inner portion is under the substrate when the substrate is supported on the pad. The bridge is flexible and connects the first fixed member and the second fixed member to support the outer circumference portion of the substrate. An upper surface of the bridge is inclined downward from the first fixed member toward the second fixed member when the substrate is not supported on the pad.
Public/Granted literature
- US20200176299A1 SUBSTRATE SUPPORT DEVICE, SUBSTRATE CONVEYANCE ROBOT, AND ALIGNER DEVICE Public/Granted day:2020-06-04
Information query
IPC分类: