Invention Grant
- Patent Title: Semiconductor FET device with bottom isolation and high-κ first
-
Application No.: US16899430Application Date: 2020-06-11
-
Publication No.: US11295988B2Publication Date: 2022-04-05
- Inventor: Ruilong Xie , Julien Frougier , Jingyun Zhang , Alexander Reznicek , Takashi Ando
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Robert Sullivan
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/49 ; H01L29/786 ; H01L21/02 ; H01L21/28 ; H01L29/66

Abstract:
Semiconductor FET devices with bottom dielectric isolation and high-κ first are provided. In one aspect, a semiconductor FET device includes: a substrate; at least one device stack including active layers oriented horizontally one on top of another on the substrate; source and drains alongside the active layers; and gates, offset from the source and drains by inner spacers, surrounding a portion of each of the active layers, wherein the gates include a gate dielectric that wraps around the active layers but is absent from sidewalls of the inner spacers. A method of forming a semiconductor FET device is also provided.
Public/Granted literature
- US20210391222A1 Semiconductor FET Device with Bottom Isolation and High-k First Public/Granted day:2021-12-16
Information query
IPC分类: