Invention Grant
- Patent Title: Formation of conductive connection tracks in package mold body using electroless plating
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Application No.: US16929813Application Date: 2020-07-15
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Publication No.: US11296000B2Publication Date: 2022-04-05
- Inventor: Cher Hau Danny Koh , Norliza Morban , Yong Chern Poh , Khay Chwan Saw , Si Hao Vincent Yeo
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/31 ; H01L23/482 ; H01L21/768 ; H01L23/528 ; H01L25/00 ; H01L23/00 ; H01L23/495
Abstract:
An electronic circuit includes a first packaged semiconductor device having a first semiconductor die including a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound. A conductive track is formed in the outer surface of the first mold compound.
Public/Granted literature
- US20200350222A1 Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating Public/Granted day:2020-11-05
Information query
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