Invention Grant
- Patent Title: Thermal conducting sheet, method for manufacturing thermal conducting sheet, heat dissipation member, and semiconductor device
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Application No.: US16069946Application Date: 2017-01-13
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Publication No.: US11296007B2Publication Date: 2022-04-05
- Inventor: Hiroki Kanaya , Shinichi Uchida , Keisuke Aramaki
- Applicant: Dexerials Corporation
- Applicant Address: JP Tokyo
- Assignee: Dexerials Corporation
- Current Assignee: Dexerials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: JPJP2016-005400 20160114,JPJP2016-254243 20161227
- International Application: PCT/JP2017/001121 WO 20170113
- International Announcement: WO2017/122817 WO 20170720
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/373 ; C08K9/08 ; C08K3/28 ; H01L23/42 ; C08K3/22 ; C08L83/04 ; B32B27/28 ; B32B38/00 ; H01L21/48
Abstract:
Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
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