Disclosed are a triode packaging method and a triode. The method includes: providing a carrier, and covering at least one surface of the carrier with a surface metal layer; covering a circuit pattern region of the surface metal layer with a resist film; electroplating a non-circuit pattern region of the surface metal layer, to form at least one first bonding pad; welding a chip on the at least one first bonding pad; welding a second bonding pad on the chip to form a triode template; performing plastic packaging on the triode template by using a composite material; drilling blind holes in vertical directions of the second bonding pad and the at least one first bonding pad, and processing the blind holes into metallic blind holes; and performing pattern fabrication on the metallic blind holes to form a closed-circuit loop or a non-closed-circuit loop, and obtaining a triode through packaging.