Invention Grant
- Patent Title: Source/drain regions of semiconductor devices and methods of forming the same
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Application No.: US16901791Application Date: 2020-06-15
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Publication No.: US11296080B2Publication Date: 2022-04-05
- Inventor: Wei Hao Lu , Yi-Fang Pai , Cheng-Wen Cheng , Li-Li Su , Chien-I Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/167 ; H01L29/08

Abstract:
A semiconductor device includes: a first fin and a second fin extending from a substrate and an epitaxial source/drain region. The epitaxial source/drain region includes a first portion grown on the first fin and a second portion grown on the second fin, and the first portion and the second portion are joined at a merging boundary. The epitaxial source/drain region further includes a first subregion extending from a location level with a highest point of the epitaxial source/drain region to a location level with a highest point of the merging boundary, a second subregion extending from the location level with the highest point of the merging boundary to a location level with a lowest point of the merging boundary, and a third subregion extending from the location level with the lowest point of the merging boundary to a location level with a top surface of an STI region.
Public/Granted literature
- US20210391324A1 Semiconductor Device and Methods of Forming Thereof Public/Granted day:2021-12-16
Information query
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