Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16233358Application Date: 2018-12-27
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Publication No.: US11296121B2Publication Date: 2022-04-05
- Inventor: Shunpei Yamazaki , Hidekazu Miyairi , Akiharu Miyanaga , Kengo Akimoto , Kojiro Shiraishi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2008-197147 20080731
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L29/24 ; H01L29/66 ; G02F1/1333 ; G02F1/1335 ; G02F1/1343 ; G02F1/1362 ; G02F1/1368 ; G09G3/36 ; H01L27/32

Abstract:
An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having higher carrier concentration than the semiconductor layer is provided intentionally between the source and drain electrode layers and the semiconductor layer, whereby an ohmic contact is formed.
Public/Granted literature
- US20190157461A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-05-23
Information query
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