- Patent Title: Image sensor including planar boundary between optical black and active pixel sensor areas with a wiring layer comprising a stepped portion and a via contact portion that penetrates through the pad area of a substrate
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Application No.: US16986419Application Date: 2020-08-06
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Publication No.: US11296134B2Publication Date: 2022-04-05
- Inventor: Yu-jin Ahn , Jong-cheol Shin , Min-ji Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2013-0026811 20130313
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor includes a substrate including a sensor array area, a pad area, and a circuit area, a wiring layer on the pad area, and a light-shielding pattern on the sensor array area. The sensor array area includes a first area including active pixels and a second area including optical back pixels. The wiring layer is apart from the substrate by a first distance on the pad area. The light-shielding pattern includes a first portion spaced apart from the substrate by a second distance less than the first distance, a second portion disposed between the first portion and the wiring layer and extending on the same level as the wiring layer, and a third portion disposed between the first portion and the second portion and integrally formed with the first portion and the second portion.
Information query
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