Invention Grant
- Patent Title: Image capturing assembly and packaging method thereof, lens module, and electronic device
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Application No.: US16236840Application Date: 2018-12-31
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Publication No.: US11296141B2Publication Date: 2022-04-05
- Inventor: Da Chen , Mengbin Liu
- Applicant: Ningbo Semiconductor International Corporation
- Applicant Address: CN Ningbo
- Assignee: Ningbo Semiconductor International Corporation
- Current Assignee: Ningbo Semiconductor International Corporation
- Current Assignee Address: CN Ningbo
- Agency: Anova Law Group, PLLC
- Priority: CN201811386733.8 20181120
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00 ; H01L31/18
Abstract:
The present disclosure provides an image capturing assembly and its packaging method, a lens module and an electronic device. The packaging method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; providing a carrier substrate and temporarily bonding the photosensitive chip and functional components on the carrier substrate; and forming an encapsulation layer on the carrier substrate and at least between the photosensitive chip and the functional components.
Public/Granted literature
- US20200161346A1 IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, AND ELECTRONIC DEVICE Public/Granted day:2020-05-21
Information query
IPC分类:
