Invention Grant
- Patent Title: LED package set and LED bulb including same
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Application No.: US16618004Application Date: 2018-05-30
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Publication No.: US11296142B2Publication Date: 2022-04-05
- Inventor: Seong Jin Lee , Jong Kook Lee
- Applicant: Seoul Semiconductor Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2017-0067992 20170531
- International Application: PCT/KR2018/006137 WO 20180530
- International Announcement: WO2018/221952 WO 20181206
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/50 ; F21K9/235 ; F21Y113/13 ; F21Y115/10

Abstract:
An LED package set including a substrate, a first LED package disposed on the substrate and including at least one first LED chip, a second LED package disposed on the substrate and including at least one second LED chip, and a resistor disposed on the substrate, connected to the first LED package in series, and connected to the second LED package in parallel, in which the second LED package is connected in parallel to the first LED package and the resistor, and the first LED package and the second LED package are configured to emit light having different color temperatures.
Public/Granted literature
- US20200168660A1 LED PACKAGE SET AND LED BULB INCLUDING SAME Public/Granted day:2020-05-28
Information query
IPC分类: