Invention Grant
- Patent Title: Method for manufacturing non-volatile memory
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Application No.: US16848168Application Date: 2020-04-14
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Publication No.: US11296194B2Publication Date: 2022-04-05
- Inventor: Dan Ning , Tengfeng Wang
- Applicant: Chengdu Analog Circuit Technology Inc
- Applicant Address: CN Chengdu
- Assignee: Chengdu Analog Circuit Technology Inc
- Current Assignee: Chengdu Analog Circuit Technology Inc
- Current Assignee Address: CN Chengdu
- Agency: Central California IP Group, P.C.
- Agent Andrew D. Fortney
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L27/11524 ; H01L29/66 ; H01L21/3213 ; H01L29/49

Abstract:
The present invention relates to a method for manufacturing a nonvolatile memory, including the steps of: forming a gate oxide layer on a substrate; forming a stacked capacitor of a storage cell after making a logic gate polysilicon undertake at least two deposition processes; and removing the extra logic gate polysilicon by an etching process to form a storage transistor and a peripheral logic transistor. According to the method of the present invention, the stacked capacitor of the storage transistor is formed by depositing at least twice, and the memory is manufactured in a standard logic process, which makes the manufacturing process of the memory simpler, the memory has good compatibility with the logic process and has low cost.
Public/Granted literature
- US20200243653A1 METHOD FOR MANUFACTURING NON-VOLATILE MEMORY Public/Granted day:2020-07-30
Information query
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