Invention Grant
- Patent Title: Electrical coupling structure, semiconductor device, and electronic apparatus
-
Application No.: US16635617Application Date: 2018-06-19
-
Publication No.: US11296215B2Publication Date: 2022-04-05
- Inventor: Kazuyuki Tomida
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Michael Best & Friedrich LLP
- Priority: JPJP2017-152141 20170807
- International Application: PCT/JP2018/023175 WO 20180619
- International Announcement: WO2019/031067 WO 20190214
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/113 ; H01L29/78 ; H01L21/28 ; H01L29/417
Abstract:
[Object] To stably form a low-resistance electrical coupling between a metal and a semiconductor.
[Solution] An electrical coupling structure includes: a semiconductor layer; a metal layer; and an intermediate layer that is held between the semiconductor layer and the metal layer, and includes an insulating layer provided on the semiconductor layer side and a two-dimensional material layer provided on the metal layer side.
[Solution] An electrical coupling structure includes: a semiconductor layer; a metal layer; and an intermediate layer that is held between the semiconductor layer and the metal layer, and includes an insulating layer provided on the semiconductor layer side and a two-dimensional material layer provided on the metal layer side.
Public/Granted literature
- US20200243676A1 ELECTRICAL COUPLING STRUCTURE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2020-07-30
Information query
IPC分类:
