- Patent Title: Semiconductor device and semiconductor device manufacturing method
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Application No.: US16962558Application Date: 2019-02-01
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Publication No.: US11296233B2Publication Date: 2022-04-05
- Inventor: Shunpei Yamazaki , Katsuaki Tochibayashi , Kensuke Yoshizumi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JPJP2018-021908 20180209
- International Application: PCT/IB2019/050802 WO 20190201
- International Announcement: WO2019/155329 WO 20190815
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/00 ; H01L29/786 ; H01L29/423 ; H01L29/51

Abstract:
A semiconductor device having favorable electrical characteristics can be provided. The semiconductor device having favorable electrical characteristics is provided. The semiconductor device has a structure including a first metal oxide layer including a first region, and a second region and a third region in which phosphorus, boron, aluminum, or magnesium is added and between which the first region is sandwiched; a conductive layer which overlaps with the first region; a first insulating layer which covers a side surface and a bottom surface of the conductive layer; a second metal oxide layer which covers a side surface and a bottom surface of the first insulating layer and is in contact with a top surface of the first region; a second insulating layer in contact with a top surface of the second region and a top surface of the third region and in contact with a side surface of the second metal oxide layer; a third insulating layer positioned over the second insulating layer and in contact with a side surface of the second metal oxide layer; a fourth insulating layer positioned over the third insulating layer and in contact with a side surface of the second metal oxide layer; a fifth insulating layer in contact with a top surface of the conductive layer, a top surface of the first insulating layer, a top surface of the second metal oxide layer, and a top surface of the fourth insulating layer.
Information query
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