Invention Grant
- Patent Title: Photosensitive device and manufacturing method thereof, detection substrate and array substrate
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Application No.: US16812764Application Date: 2020-03-09
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Publication No.: US11296249B2Publication Date: 2022-04-05
- Inventor: Tianmin Zhou , Rui Huang , Lizhong Wang , Jipeng Song , Tao Yang , Zhaohui Qiang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201910752416.1 20190814
- Main IPC: H01L31/101
- IPC: H01L31/101 ; H01L31/11 ; H01L31/0224 ; H01L31/0236 ; H01L31/0392

Abstract:
A photosensitive device, a manufacturing method thereof, a detection substrate and an array substrate are provided. The photosensitive device is formed on a substrate, and it includes a photosensitive element and a thin film transistor. The photosensitive element includes a first electrode layer on the substrate; a second electrode layer on a side of the first electrode layer distal to the substrate; and a photoelectric conversion layer between the first electrode layer and the second electrode layer. The thin film transistor is electrically connected to the photosensitive element, and it includes a first gate electrode on the substrate; an active layer on a side of the first gate electrode distal to the substrate; and a second gate electrode on a side of the active layer distal to the substrate. The first electrode layer and the second gate electrode are located in the same layer.
Public/Granted literature
- US20210050469A1 PHOTOSENSITIVE DEVICE AND MANUFACTURING METHOD THEREOF, DETECTION SUBSTRATE AND ARRAY SUBSTRATE Public/Granted day:2021-02-18
Information query
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