Invention Grant
- Patent Title: Optoelectronic modules having transparent substrates and method for manufacturing the same
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Application No.: US16957185Application Date: 2018-12-26
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Publication No.: US11296270B2Publication Date: 2022-04-05
- Inventor: Bojan Tesanovic , Nicola Spring
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Michael Best & Friedrich LLP
- International Application: PCT/SG2018/050629 WO 20181226
- International Announcement: WO2019/132776 WO 20190704
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L31/02 ; H01L31/0203 ; H01L31/0232 ; H01L33/54 ; H01L33/58 ; H01S5/02 ; H01S5/02216 ; H01S5/02325

Abstract:
Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.
Information query
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