Invention Grant
- Patent Title: Millimeter-wave assembly
-
Application No.: US17237845Application Date: 2021-04-22
-
Publication No.: US11296422B2Publication Date: 2022-04-05
- Inventor: Jari Kristian Van Wonterghem , Alexander Khripkov , Dong Liu , Janne Ilvonen , Jian Ou , Ruiyuan Tian , Changnian Xu , Wei Huang , Zlatoljub Milosavljevic
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q1/24

Abstract:
A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.
Public/Granted literature
- US20210249783A1 Millimeter-Wave Assembly Public/Granted day:2021-08-12
Information query