Invention Grant
- Patent Title: Protection circuit, semiconductor device, and method
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Application No.: US17009372Application Date: 2020-09-01
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Publication No.: US11296492B2Publication Date: 2022-04-05
- Inventor: Taku Sogabe
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2019-170533 20190919
- Main IPC: H02H5/04
- IPC: H02H5/04 ; H02H3/20 ; H02H1/00

Abstract:
According to one embodiment, a protection circuit is a protection circuit for protecting an output driver element from overheat, and includes a measurer configured to measure, as a measurement value, a value proportional to a supply power amount to the output driver element, an estimator configured to estimate a temperature rise amount of the output driver element corresponding to the supply power amount, on a basis of the measurement value, a detector configured to detect an ambient temperature of the output driver element, and a determiner configured to determine whether a temperature obtained by adding the temperature rise amount estimated to the ambient temperature exceeds a predetermined threshold temperature, and to output a cutoff instruction signal for the output driver element.
Public/Granted literature
- US20210091554A1 PROTECTION CIRCUIT, SEMICONDUCTOR DEVICE, AND METHOD Public/Granted day:2021-03-25
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