Invention Grant
- Patent Title: Radio-frequency module and communication apparatus
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Application No.: US16829477Application Date: 2020-03-25
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Publication No.: US11296660B2Publication Date: 2022-04-05
- Inventor: Yusuke Naniwa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-192157 20170929
- Main IPC: H03F3/19
- IPC: H03F3/19 ; H03F1/56 ; H04B1/40

Abstract:
A radio-frequency module includes a substrate, a first circuit arranged on the substrate and includes a first amplifier for amplifying a diversity signal, and a second circuit arranged on the substrate and includes a second amplifier for amplifying a MIMO signal. The first amplifier and the second amplifier are formed on a single component and are arranged in a central portion in a plan view of the substrate. The first circuit and the second circuit may include a first matching element connected to the first amplifier and a second matching element connected to the second amplifier, respectively. The first amplifier and the second amplifier may be arranged in the central portion on a first main surface of the substrate. The first matching element and the second matching element may be arranged in the central portion on a second main surface of the substrate.
Public/Granted literature
- US20200228073A1 RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2020-07-16
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