Invention Grant
- Patent Title: Triple modular redundancy flip-flop with improved power performance area and design for testability
-
Application No.: US17065382Application Date: 2020-10-07
-
Publication No.: US11296700B1Publication Date: 2022-04-05
- Inventor: Hari Rao , Renaud Francois Henri Gelin
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H03K19/003
- IPC: H03K19/003 ; H03K3/013 ; G06F11/18

Abstract:
A triple modular redundancy (TMR) flip-flop includes a set of master-gate-latch circuits including a first set of inputs to receive a first digital signal, and a second set of inputs to receive a clock; and a voting logic circuit including a set of inputs coupled to a set of outputs of the set of master-gate-latch circuits, and an output to generate a second digital signal based on the first digital signal. Another TMR flip-flop includes a set of master-gate-latch circuits to receive a set of digital signals in response to a first edge of a clock, respectively; and latch the set of digital signals in response to a second edge of the clock, respectively; and a voting logic circuit to receive the latched set of digital signals; and generate a second digital signal based on a majority of logic levels of the latched first set of digital signals, respectively.
Public/Granted literature
- US20220109445A1 TRIPLE MODULAR REDUNDANCY FLIP-FLOP WITH IMPROVED POWER PERFORMANCE AREA AND DESIGN FOR TESTABILITY Public/Granted day:2022-04-07
Information query