Invention Grant
- Patent Title: MEMS microphone
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Application No.: US16760803Application Date: 2018-09-06
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Publication No.: US11297414B2Publication Date: 2022-04-05
- Inventor: Quanbo Zou , Yongwei Dong
- Applicant: Goertek, Inc.
- Applicant Address: CN Weifang
- Assignee: Goertek, Inc.
- Current Assignee: Goertek, Inc.
- Current Assignee Address: CN Weifang
- Agency: Baker Botts, L.L.P.
- Priority: CN201810660799.5 20180625
- International Application: PCT/CN2018/104439 WO 20180906
- International Announcement: WO2020/000648 WO 20200102
- Main IPC: H04R1/28
- IPC: H04R1/28 ; B81B3/00 ; H04R19/04

Abstract:
An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electret layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrate
Information query
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