A Microphone module (101) is disclosed which comprises a MEMS-microphone capsule (102), a PCB (103) and a sealing element (104), wherein the PCB (103) comprises on its top surface (108) a first groove (115) which opens at a first end (115a) into the first passage (109) and the PCB (103) further comprises on its top surface (108) a second groove (116) which opens at a first end (116a) into the second passage (110) and wherein the sealing element (104) is arranged on the top surface (108) of the PCB (103) and that the sealing element (104) covers the first groove (115) and the second groove (116) in such a way that the first groove (115) is transformed into a first channel (117) and the second grove (116) is transformed into a second channel (118).