This disclosure describes systems for cooling one or more data halls of a data center that include one or more sections of a cooling spine. Each section of the cooling spine includes a riser module, a manifold module, and one or more arrays of cooling units. The riser module includes riser piping configured to fluidically couple to a liquid cooling system. The manifold module includes manifold piping fluidically coupled to the riser piping. Each array of cooling units is positioned toward a data hall of the one or more data halls of the data center and includes a heat exchanger assembly and a circulation assembly. The heat exchanger assembly is fluidically coupled to the manifold piping and configured to cool return air from a hot aisle adjacent a row of cabinets. The circulation assembly is configured to discharge supply air to a cold aisle adjacent the row of cabinets.