Invention Grant
- Patent Title: Soluble material for three-dimensional molding
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Application No.: US16482169Application Date: 2018-01-25
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Publication No.: US11298871B2Publication Date: 2022-04-12
- Inventor: Jouji Hirai , Tadanori Yoshimura , Tomoya Tsuboi , Hiroki Sawada
- Applicant: KAO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KAO CORPORATION
- Current Assignee: KAO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Element IP, PLC
- Priority: JPJP2017-014072 20170130,JPJP2017-146414 20170728
- International Application: PCT/JP2018/002287 WO 20180125
- International Announcement: WO2018/139537 WO 20180802
- Main IPC: B29C64/118
- IPC: B29C64/118 ; B29C64/40 ; B33Y10/00 ; B33Y70/00

Abstract:
The present invention is a soluble material for three-dimensional modeling that is used as a material of a support material for supporting a three-dimensional object when the three-dimensional object is manufactured by a 3D printer of a fused deposition modeling system and that contains a thermoplastic resin having a hydrophilic group and an organic salt compound represented by a general formula (I) below: (R1—SO3−)nXn+ (I). According to the present invention, it is possible to provide a soluble material for three-dimensional modeling that is used for a support material and that is capable of suppressing the degradation of the modeling accuracy of a three-dimensional object when the three-dimensional object is manufactured by a 3D printer of a fused deposition modeling system, and has a high rate of dissolution to neutral water to be removable speedily from a precursor of the three-dimensional object without use of a strong alkaline aqueous solution.
Public/Granted literature
- US20200055232A1 SOLUBLE MATERIAL FOR THREE-DIMENSIONAL MOLDING Public/Granted day:2020-02-20
Information query
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