Invention Grant
- Patent Title: On-chip signal path with electrical and physical connection
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Application No.: US16717660Application Date: 2019-12-17
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Publication No.: US11299393B2Publication Date: 2022-04-12
- Inventor: Peter George Hartwell
- Applicant: INVENSENSE, INC.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: Haley Guiliano LLP
- Agent Joshua Van Hoven
- Main IPC: B81B7/00
- IPC: B81B7/00

Abstract:
An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.
Public/Granted literature
- US20210179420A1 ON-CHIP SIGNAL PATH WITH ELECTRICAL AND PHYSICAL CONNECTION Public/Granted day:2021-06-17
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