Invention Grant
- Patent Title: Method for treating a surface of a metallic structure
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Application No.: US16668147Application Date: 2019-10-30
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Publication No.: US11299814B2Publication Date: 2022-04-12
- Inventor: Jian Lu , Yang Yang Li , Weihui Ou , Binbin Zhou , Junda Shen , Chenghao Zhao
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: C25D11/02
- IPC: C25D11/02 ; C25D5/00 ; C25D5/18 ; C25D5/34
Abstract:
A method for treating a surface of a metallic structure, the metallic structure being made of a first metallic material, the method including the steps of: (a) releasing metallic ions from the surface of the metallic structure; and (b) depositing a nano-structured metallic layer onto the surface of the metallic structure from the released metallic ions, wherein the nano-structured metallic layer includes uniform nanoparticles.
Public/Granted literature
- US20210130973A1 METHOD FOR TREATING A SURFACE OF A METALLIC STRUCTURE Public/Granted day:2021-05-06
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