Invention Grant
- Patent Title: Devices and methods for bundling cables
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Application No.: US17086548Application Date: 2020-11-02
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Publication No.: US11300750B2Publication Date: 2022-04-12
- Inventor: Chi-Ming Wang , Aviral Joshi
- Applicant: CommScope Technologies LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Myers Bigel, P.A.
- Main IPC: G02B6/44
- IPC: G02B6/44 ; D07B1/18

Abstract:
The present disclosure describes a grommet formed of a polymeric material and adapted for bundling a plurality of discrete cables, comprising a main body having a generally cylindrical profile surrounding an interior cavity, the main body further having a length, a thickness, and a longitudinal axis; and a central member integrally coupled to the main body and located within the interior cavity of the main body, the central member extending generally parallel to the longitudinal axis of the main body. Methods of bundling cables are also provided.
Public/Granted literature
- US20210080672A1 DEVICES AND METHODS FOR BUNDLING CABLES Public/Granted day:2021-03-18
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