A fingerprint module includes a substrate, a plurality of fingerprint identification components, a fingerprint chip, and a plurality of metal wires. The substrate has an identification area configured to identify a fingerprint and a non-identification area located at a periphery of the identification area. The fingerprint identification components are disposed in the identification area of the substrate. The fingerprint chip is disposed in a non-identification area of the substrate. Each of the fingerprint identification components is electrically connected to the fingerprint chip through a corresponding metal wire.