Invention Grant
- Patent Title: Input/Output modules
-
Application No.: US16500108Application Date: 2018-01-19
-
Publication No.: US11301409B2Publication Date: 2022-04-12
- Inventor: Sebastien Marcet
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Michael A. Dryja
- Priority: EP17305413 20170407
- International Application: PCT/US2018/014442 WO 20180119
- International Announcement: WO2018/186926 WO 20181011
- Main IPC: G06F13/40
- IPC: G06F13/40

Abstract:
An Input/Output, I/O, module comprising a module body, a first connector disposed on a first part of the module body, and an I/O port disposed on a second part of the module body and electrically connected to the first connector. The I/O module is locatable in a module slot of an electronic device such that the first connector couples to a second connector of the module slot to electrically connect, the I/O port to the electronic device. A corresponding electronic device is also disclosed.
Public/Granted literature
- US20210103542A1 INPUT/OUTPUT MODULES Public/Granted day:2021-04-08
Information query