Invention Grant
- Patent Title: Three-dimensional measurement system and three-dimensional measurement method
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Application No.: US16963248Application Date: 2019-02-14
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Publication No.: US11302022B2Publication Date: 2022-04-12
- Inventor: Yasuhiro Ohnishi , Takashi Shimizu , Shinya Matsumoto
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JPJP2018-023744 20180214
- International Application: PCT/JP2019/005332 WO 20190214
- International Announcement: WO2019/160032 WO 20190822
- Main IPC: G06T7/593
- IPC: G06T7/593 ; H04N13/254 ; H04N13/239 ; G01B11/245 ; G01B11/25

Abstract:
A three-dimensional measurement system capable of realizing high-speed processing while increasing measurement resolution are provided. The system includes: an image capture unit including a first and second image capture units that are spaced apart; a first calculation unit calculates a parallax at first feature points in the images using distance information of a three-dimensional measurement method other than a stereo camera method or information for calculating a distance, using at least one of the first and second image capture units; and a second calculation unit calculates a parallax at second feature points based on a corresponding point for the second feature point by using the stereo camera method using the first and second image capture units, and specifies a three-dimensional shape based on the parallax at the first and second feature points. The second calculation unit sets a search area based on the parallax at the first feature points.
Public/Granted literature
- US20210358157A1 THREE-DIMENSIONAL MEASUREMENT SYSTEM AND THREE-DIMENSIONAL MEASUREMENT METHOD Public/Granted day:2021-11-18
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