Invention Grant
- Patent Title: Multilayer coil electronic component
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Application No.: US16199047Application Date: 2018-11-23
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Publication No.: US11302466B2Publication Date: 2022-04-12
- Inventor: Takashi Suzuki , Hidekazu Sato , Yusuke Nagai , Kouichi Kakuda , Kunihiko Kawasaki , Shinichi Kondo , Yuya Ishima , Shinichi Sato , Masaki Takahashi , Takashi Endo
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-252185 20171227
- Main IPC: H01F1/147
- IPC: H01F1/147 ; H01F1/33 ; H01F27/28 ; H01F17/04 ; H01F17/00 ; H01F1/24 ; H01F1/26 ; H01F27/29 ; H01F27/255

Abstract:
A multilayer coil electronic component having improved inductance L, Q, and strength, and which has an element in which a coil conductor and a magnetic element body are stacked. The magnetic element body includes soft magnetic metal particles and a resin. The resin fills a space between the soft magnetic metal particles. Each of soft magnetic metal particles has a soft magnetic metal particle core and an oxide film covering the soft magnetic metal particle core. A layer of the oxide film contacting the soft magnetic metal particle core is made of an oxide including Si.
Public/Granted literature
- US20190198210A1 MULTILAYER COIL ELECTRONIC COMPONENT Public/Granted day:2019-06-27
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