Invention Grant
- Patent Title: Semiconductor element
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Application No.: US16701751Application Date: 2019-12-03
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Publication No.: US11302470B2Publication Date: 2022-04-12
- Inventor: Hsiao-Tsung Yen , Cheng-Wei Luo , Yuh-Sheng Jean , Ta-Hsun Yeh
- Applicant: REALTEK SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: TW105124973 20160805
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01L23/522 ; H01L49/02 ; H01F27/29 ; H01F17/00 ; H01F19/04

Abstract:
A semiconductor element includes a first coil substantially located at a first plane; a second coil substantially located at the first plane; a connecting section that connects the first coil and the second coil; a third coil substantially located at a second plane different from the first plane; and a fourth coil substantially located at the second plane. The third coil and the first coil are connected through a through structure, and the fourth coil and the second coil are connected through a through structure. The third coil and the fourth are not directly connected.
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