A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, in which the external electrode each include an electrode layer electrically connected to the internal electrodes and a plating layer disposed on the electrode layer, and a thickness of the electrode layer in a cross section of the ceramic body in first and second directions is 10 μm or more.