- Patent Title: Electronic component and substrate having the same mounted thereon
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Application No.: US16867849Application Date: 2020-05-06
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Publication No.: US11302481B2Publication Date: 2022-04-12
- Inventor: Beom Joon Cho , Jae Young Na , Ki Young Kim , Ji Hong Jo , Woo Chul Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0090176 20190725
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G4/224 ; H01G4/30 ; H01G4/232 ; H05K1/18 ; H05K1/11

Abstract:
An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.
Public/Granted literature
- US20210027946A1 ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON Public/Granted day:2021-01-28
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