Invention Grant
- Patent Title: Zincblende structure group III-nitride
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Application No.: US16496388Application Date: 2018-03-29
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Publication No.: US11302530B2Publication Date: 2022-04-12
- Inventor: David John Wallis , Martin Frentrup , Menno Johannes Kappers , Suman-Lata Sahonta
- Applicant: Cambridge Enterprise Limited , Anvil Semiconductors Limited
- Applicant Address: GB Cambridge; GB Allesley
- Assignee: Cambridge Enterprise Limited,Anvil Semiconductors Limited
- Current Assignee: Cambridge Enterprise Limited,Anvil Semiconductors Limited
- Current Assignee Address: GB Cambridge; GB Allesley
- Agency: Bozicevic, Field & Francis LLP
- Agent Rudy J. Ng
- Priority: WOPCT/EP2017/057764 20170331
- International Application: PCT/EP2018/058250 WO 20180329
- International Announcement: WO2018/178315 WO 20181004
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/02 ; H01L33/32 ; H01L29/04 ; H01L33/00

Abstract:
A method is disclosed of manufacturing a semiconductor structure comprising an (001) oriented zincblende structure group III-nitride layer, such as GaN. The layer is formed on a 3C—SiC layer on a silicon substrate. A nucleation layer is formed, recrystallized and then the zincblende structure group III-nitride layer is formed by MOVPE at temperature T3 in the range 750-1000° C., to a thickness of at least 0.5 μm. There is also disclosed a corresponding semiconductor structure comprising a zincblende structure group III-nitride layer which, when characterized by XRD, shows that the substantial majority, or all, of the layer is formed of zincblende structure group III-nitride in preference to wurtzite structure group III-nitride.
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