Invention Grant
- Patent Title: Conveyance apparatus, substrate processing apparatus, and method of manufacturing article
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Application No.: US16711937Application Date: 2019-12-12
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Publication No.: US11302551B2Publication Date: 2022-04-12
- Inventor: Yuichiro Morikuni
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JPJP2018-240140 20181221
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/687 ; H01L21/68

Abstract:
A conveyance apparatus comprises a first movable device to move while holding an object, a second movable device to move while holding the object and transfer the object to the first movable device, and a controller to control the first and second movable devices. The second movable device includes a guide member and a hand arranged so as to be capable of reciprocally moving along the guide member while holding the object. The controller estimates, based on a driving history of the second movable device, a thermal deformation amount of the guide member corresponding to the reciprocal movement of the hand along the guide member, and corrects, based on the estimated thermal deformation amount, a drive command value used to move the first movable device to a position to receive the object from the second movable device.
Information query
IPC分类: