Invention Grant
- Patent Title: Pixel, associated image sensor, and method
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Application No.: US16689938Application Date: 2019-11-20
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Publication No.: US11302727B2Publication Date: 2022-04-12
- Inventor: Hui Zang , Qin Wang , Gang Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop GPM LLP
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; H01L29/78 ; H01L29/66 ; H01L29/423

Abstract:
A pixel includes a semiconductor substrate, a photodiode region, a floating diffusion region, and a dielectric layer. The substrate has a top surface forming a trench lined by the dielectric layer, and having a trench depth relative to a planar region of the top surface. The photodiode region is in the substrate and includes a bottom photodiode section beneath the trench and a top photodiode section adjacent to the trench, adjoining the bottom photodiode section, and extending toward the planar region to a photodiode depth less than the trench depth. The floating diffusion region is adjacent to the trench and has a junction depth less than the trench depth. A top region of the dielectric layer is between the planar region and the junction depth. A bottom region of the dielectric layer is between the photodiode depth and the trench depth, and thicker than the top region.
Public/Granted literature
- US20210151487A1 PIXEL, ASSOCIATED IMAGE SENSOR, AND METHOD Public/Granted day:2021-05-20
Information query
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