Invention Grant
- Patent Title: Connector assembly
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Application No.: US17063769Application Date: 2020-10-06
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Publication No.: US11303053B2Publication Date: 2022-04-12
- Inventor: Yukitaka Tanaka , Yuki Suda
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2019-218489 20191203
- Main IPC: H01R12/79
- IPC: H01R12/79 ; H01R12/77

Abstract:
A connector assembly comprises a connector and a mating connector. The connector is attachable with a connecting object having a sheet-like shape. The connecting object has a wiring layer, a conductive layer and an insulator. The wiring layer includes at least one trace. The trace has a first contact portion. The conductive layer has at least two second contact portions. The connector is mateable with the mating connector along a first direction. The mating connector comprises at least one mating first terminal and at least two mating second terminals. Under a mated state where the connector in the attached state is mated with the mating connector, the first contact portion is positioned between two of the mating second terminals in a second direction perpendicular to the first direction. The second contact portions are brought into contact with the mating second terminals, respectively, under the mated state.
Public/Granted literature
- US20210167535A1 CONNECTOR ASSEMBLY Public/Granted day:2021-06-03
Information query
IPC分类: