Invention Grant
- Patent Title: Connector and manufacturing method therefor
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Application No.: US16765189Application Date: 2018-11-20
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Publication No.: US11303061B2Publication Date: 2022-04-12
- Inventor: Hiroki Yamada
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JPJP2017-224886 20171122
- International Application: PCT/JP2018/042755 WO 20181120
- International Announcement: WO2019/102977 WO 20190531
- Main IPC: H01R13/504
- IPC: H01R13/504 ; B29C45/14 ; B29C45/27 ; B29L31/36

Abstract:
A connector (1) includes a plurality of connector terminals (3), core resin portions (2A), (2B), nuts (4) and an outer resin portion (5). A plurality of the nuts (4) are arranged to face a nut facing surface (21A) of the core resin portion (2A). The outer resin portion (5) covers the core resin portions (2A), (2B) and the nuts (4) with exposed surfaces (25) of the core resin portions (2A), (2B) and outer end surfaces (41) of the nuts (4) exposed. Injection marks (51) during molding of the outer resin portion (5) are formed on a surface of a part of the outer resin portion (5) covering an opposite side surface (22B) located on a side opposite to the nut facing surface (21A).
Public/Granted literature
- US20200350723A1 CONNECTOR AND MANUFACTURING METHOD THEREFOR Public/Granted day:2020-11-05
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